Onsemi aims to quadruple power density of EV inverters
Onsemi has introduced the Embedded Power Platform (EPP), a new architecture for power electronics. According to the semiconductor manufacturer, it enables up to four times higher power density and 15 per cent lower power losses in traction inverters for electric vehicles.
Wafer of the new Embedded Power Platform from Onsemi for highly integrated power electronics.
Image: Onsemi
One of the first automotive industry partners is Subaru. The Japanese manufacturer intends to evaluate the Embedded Power Platform (EPP) for future electrified vehicle architectures and will receive early access to engineering samples, simulation models and technical expertise from Onsemi. However, no decision has yet been made regarding its use in a production vehicle.
The technical approach differs primarily in its packaging compared to conventional solutions. With EPP, the silicon wafer itself serves as the foundation of the package. This allows for the integration of various semiconductor technologies—such as silicon, silicon carbide (SiC) and gallium nitride (GaN)—as well as multiple components like FETs, drivers and controllers within a single package.
This enables Onsemi to develop, simulate and optimise electrical, thermal and mechanical properties within a unified architecture, rather than addressing them largely in isolation before combining them. Among other benefits, the reduced parasitic inductance is expected to lower electrical losses while enabling higher switching frequencies.
According to Onsemi, EPP can be manufactured on the company’s existing 12-inch silicon wafer lines, allowing key integration steps to take place directly within semiconductor production. For electric vehicles, Onsemi sees a primary application in traction inverters. Compared to conventional approaches, the manufacturer promises up to four times higher power density with up to 15 per cent lower power losses. This could result in smaller and lighter inverters. However, the announcement does not specify how these figures translate under real-world operating conditions.
Scalability is another key advantage: an EPP-based inverter architecture can be deployed across various power classes. Vehicle manufacturers could thus use a common base design for different models, rather than developing separate solutions for each power class. Onsemi anticipates reduced development and qualification efforts, as well as lower development and production costs.
For the EPP platform as a whole, Onsemi cites a three- to five-fold increase in power density depending on the application. In some cases, development cycles could be shortened to as little as four months. However, these figures apply to the platform as a whole and not specifically to a validated automotive series application.
Beyond the automotive sector, Onsemi is also targeting industrial applications and power supply for AI data centres with the platform. The semiconductor manufacturer sees the advantage of scaling the same integration architecture across different applications and semiconductor technologies. The Embedded Power Platform is currently in an early phase, with initial samples expected to be delivered to selected customers and development partners in the automotive and AI industries later this year.